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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core 4 kB/8 kB 3 V Flash with 256-byte data RAM
Rev. 04 -- 06 January 2004 Product data
1. General description
The P89LPC930/931 is a single-chip microcontroller designed for applications demanding high-integration, low cost solutions over a wide range of performance requirements. The P89LPC930/931 is based on a high performance processor architecture that executes instructions in two to four clocks, six times the rate of standard 80C51 devices. Many system-level functions have been incorporated into the P89LPC930/931 in order to reduce component count, board space, and system cost.
2. Features
s A high performance 80C51 CPU provides instruction cycle times of 167-333 ns for all instructions except multiply and divide when executing at 12 MHz. This is 6 times the performance of the standard 80C51 running at the same clock frequency. A lower clock frequency for the same performance results in power savings and reduced EMI. s 2.4 V to 3.6 V VDD operating range. I/O pins are 5 V tolerant (may be pulled up or driven to 5.5 V). s 4 kB/8 kB Flash code memory with 1 kB sectors, and 64-byte page size. s Byte-erase allowing code memory to be used for data storage. s Flash program operation completes in 2 ms. s Flash erase operation completes in 2 ms. s 256-byte RAM data memory. s Two 16-bit counter/timers. Each timer may be configured to toggle a port output upon timer overflow or to become a PWM output. s Real-Time clock that can also be used as a system timer. s Two analog comparators with selectable inputs and reference source. s Enhanced UART with fractional baud rate generator, break detect, framing error detection, automatic address detection and versatile interrupt capabilities. s 400 kHz byte-wide I2C-bus communication port. s SPI communication port. s Eight keypad interrupt inputs, plus two additional external interrupt inputs. s Four interrupt priority levels. s Watchdog timer with separate on-chip oscillator, requiring no external components. The Watchdog time-out time is selectable from 8 values. s Active-LOW reset. On-chip power-on reset allows operation without external reset components. A reset counter and reset glitch suppression circuitry prevent spurious and incomplete resets. A software reset function is also available.
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
s Low voltage reset (Brownout detect) allows a graceful system shutdown when power fails. May optionally be configured as an interrupt. s Oscillator Fail Detect. The Watchdog timer has a separate fully on-chip oscillator allowing it to perform an oscillator fail detect function. s Configurable on-chip oscillator with frequency range and RC oscillator options (selected by user programmed Flash configuration bits). The RC oscillator option allows operation without external oscillator components. Oscillator options support frequencies from 20 kHz to the maximum operating frequency of 12 MHz. The RC oscillator option is selectable and fine tunable. s Programmable port output configuration options: x Quasi-bidirectional x Open drain x Push-pull x Input-only s Port `input pattern match' detect. Port 0 may generate an interrupt when the value of the pins match or do not match a programmable pattern. s Second data pointer. s Schmitt trigger port inputs. s LED drive capability (20 mA) on all port pins. Maximum combined I/O current of 100 mA. s Controlled slew rate port outputs to reduce EMI. Outputs have approximately 10 ns minimum ramp times. s 23 I/O pins minimum (28-pin package). Up to 26 I/O pins while using on-chip oscillator and reset options. s Only power and ground connections are required to operate the P89LPC930/931 using on-chip oscillator and on-chip reset options. s Serial Flash programming allows in-circuit production coding. Flash security bits prevent reading of sensitive programs. s In-Application Programming of the Flash code memory. This allows changing the code in a running application. s Idle and two different Power-down reduced power modes. Improved wake-up from Power-down mode (a low interrupt input starts execution). Typical Power-down current is 1 A (total Power-down with voltage comparators disabled). s 28-pin TSSOP package. s Emulation support.
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Product data
Rev. 04 -- 06 January 2004
2 of 54
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
3. Ordering information
Table 1: Ordering information Package Name P89LPC930FDH P89LPC931FDH TSSOP28 TSSOP28 Description plastic thin shrink small outline package; 28 leads; body width 4.4 mm plastic thin shrink small outline package; 28 leads; body width 4.4 mm Version SOT361-1 SOT361-1 Type number
3.1 Ordering options
Table 2: Part options Program memory 4 kB 8 kB Temperature range -45 C to +85 C -45 C to +85 C Frequency 0 to 12 MHz 0 to 12 MHz Type number P89LPC930FDH P89LPC931FDH
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Product data
Rev. 04 -- 06 January 2004
3 of 54
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
4. Block diagram
HIGH PERFORMANCE ACCELERATED 2-CLOCK 80C51 CPU
4 kB/8 kB CODE FLASH INTERNAL BUS 256-BYTE DATA RAM PORT 3 CONFIGURABLE I/Os PORT 2 CONFIGURABLE I/Os PORT 1 CONFIGURABLE I/Os PORT 0 CONFIGURABLE I/Os
UART
I2C
SPI
REAL-TIME CLOCK/ SYSTEM TIMER TIMER 0 TIMER 1 WATCHDOG TIMER AND OSCILLATOR
KEYPAD INTERRUPT
ANALOG COMPARATORS
PROGRAMMABLE OSCILLATOR DIVIDER
CPU CLOCK ON-CHIP RC OSCILLATOR
CRYSTAL OR RESONATOR
CONFIGURABLE OSCILLATOR
POWER MONITOR (POWER-ON RESET, BROWNOUT RESET)
002aaa428
Fig 1. Block diagram.
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Product data
Rev. 04 -- 06 January 2004
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Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
5. Pinning information
5.1 Pinning
handbook, halfpage
P2.0 P2.1 KBIO/CMP2/P0.0 P1.7 P1.6 RST/P1.5 VSS XTAL1/P3.1 CLKOUT/XTAL2/P3.0
1 2 3 4 5
28 P2.7 27 P2.6 26 P0.1/CIN2B/KBI1 25 P0.2/CIN2A/KBI2 24 P0.3/CIN1B/KBI3
P89LPC930FDH P89LPC931FDH
002aaa429
6 7 8 9
23 P0.4/CIN1A/KBI4 22 P0.5/CMPREF/KBI5 21 VDD 20 P0.6/CMP1/KBI6 19 P0.7/T1/KBI7 18 P1.0/TXD 17 P1.1/RXD 16 P2.5/SPICLK 15 P2.4/SS
INT1/P1.4 10 SDA/INT0/P1.3 11 SCL/T0/P1.2 12 MOSI/P2.2 13 MISO/P2.3 14
Fig 2. DIP28 pin configuration.
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Product data
Rev. 04 -- 06 January 2004
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Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
5.2 Pin description
Table 3: Symbol P0.0 - P0.7 Pin description Pin Type Description Port 0: Port 0 is an 8-bit I/O port with a user-configurable output type. During reset Port 0 latches are configured in the input only mode with the internal pull-up disabled. The operation of Port 0 pins as inputs and outputs depends upon the port configuration selected. Each port pin is configured independently. Refer to Section 8.11.1 "Port configurations" and Table 7 "DC electrical characteristics" for details. The Keypad Interrupt feature operates with Port 0 pins. All pins have Schmitt triggered inputs. Port 0 also provides various special functions as described below: 3 I/O O I 26 I/O I I 25 I/O I I 24 I/O I I 23 I/O I I 22 I/O I I 20 I/O O I 19 I/O I/O I P0.0 -- Port 0 bit 0. CMP2 -- Comparator 2 output. KBI0 -- Keyboard input 0. P0.1 -- Port 0 bit 1. CIN2B -- Comparator 2 positive input B. KBI1 -- Keyboard input 1. P0.2 -- Port 0 bit 2. CIN2A -- Comparator 2 positive input A. KBI2 -- Keyboard input 2. P0.3 -- Port 0 bit 3. CIN1B -- Comparator 1 positive input B. KBI3 -- Keyboard input 3. P0.4 -- Port 0 bit 4. CIN1A -- Comparator 1 positive input A. KBI4 -- Keyboard input 4. P0.5 -- Port 0 bit 5. CMPREF -- Comparator reference (negative) input. KBI5 -- Keyboard input 5. P0.6 -- Port 0 bit 6. CMP1 -- Comparator 1 output. KBI6 -- Keyboard input 6. P0.7 -- Port 0 bit 7. T1 -- Timer/counter 1 external count input or overflow output. KBI7 -- Keyboard input 7. 3, 26, 25, I/O 24, 23, 22, 20, 19
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Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Table 3: Symbol P1.0 - P1.7
Pin description...continued Pin Type Description 18, 17, 12, I/O, I [1] Port 1: Port 1 is an 8-bit I/O port with a user-configurable output type, except for 11, 10, 6, three pins as noted below. During reset Port 1 latches are configured in the input only 5, 4 mode with the internal pull-up disabled. The operation of the configurable Port 1 pins as inputs and outputs depends upon the port configuration selected. Each of the configurable port pins are programmed independently. Refer to Section 8.11.1 "Port configurations" and Table 7 "DC electrical characteristics" for details. P1.2 - P1.3 are open drain when used as outputs. P1.5 is input only. All pins have Schmitt triggered inputs. Port 1 also provides various special functions as described below: 18 17 12 I/O O I/O I I/O I/O I/O 11 I I I/O 10 6 I I I I P1.0 -- Port 1 bit 0. TxD -- Transmitter output for the serial port. P1.1 -- Port 1 bit 1. RXD -- Receiver input for the serial port. P1.2 -- Port 1 bit 2 (open-drain when used as output). T0 -- Timer/counter 0 external count input or overflow output (open-drain when used as output). SCL -- I2C serial clock input/output. P1.3 -- Port 1 bit 3 (open-drain when used as output). INT0 -- External interrupt 0 input. SDA -- I2C serial data input/output. P1.4 -- Port 1 bit 4. INT1 -- External interrupt 1 input. P1.5 -- Port 1 bit 5 (input only). RST -- External Reset input during Power-on or if selected via UCFG1. When functioning as a reset input a LOW on this pin resets the microcontroller, causing I/O ports and peripherals to take on their default states, and the processor begins execution at address 0. Also used during a power-on sequence to force In-System Programming mode. P1.6 -- Port 1 bit 6. P1.7 -- Port 1 bit 7.
5 4
I/O I/O
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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Table 3: Symbol P2.0 - P2.7
Pin description...continued Pin Type Description Port 2: Port 2 is a 8-bit I/O port with a user-configurable output type. During reset Port 2 latches are configured in the input only mode with the internal pull-up disabled. The operation of port 2 pins as inputs and outputs depends upon the port configuration selected. Each port pin is configured independently. Refer to the section on I/O port configuration and the DC Electrical Characteristics for details. This port is not available in 20-pin package and is configured automatically as outputs to conserve power. The alternate functions for these pins must not be enabled. All pins have Schmitt triggered inputs. Port 2 also provides various special functions as described below. 1 2 13 I/O I/O I/O I/O 14 I/O I/O 15 16 I/O I I/O I/O 27 28 I/O I/O P2.0 -- Port 2 bit 0. P2.1 -- Port 2 bit 1. P2.2 -- Port 2 bit 2. MOSI -- SPI master out slave in. When configured as master, this pin is output, when configured as slave, this pin is input. P2.3 -- Port 2 bit 3. MISO -- SPI master in slave out. When configured as master, this pin is input, when configured as slave, this pin is output. P2.4 -- Port 2 bit 4. SS -- SPI Slave select. P2.5 -- Port 2 bit 5. SPICLK -- SPI clock. When configured as master, this pin is output, when configured as slave, this pin is input. P2.6 -- Port 2 bit 6. P2.7 -- Port 2 bit 7. 1, 2, 13, I/O 14, 15, 16, 27, 28
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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Table 3: Symbol P3.0 - P3.1
Pin description...continued Pin 9, 8 Type I/O Description Port 3: Port 3 is an 2-bit I/O port with a user-configurable output type. During reset Port 3 latches are configured in the input only mode with the internal pull-up disabled. The operation of Port 3 pins as inputs and outputs depends upon the port configuration selected. Each port pin is configured independently. Refer to Section 8.11.1 "Port configurations" and Table 7 "DC electrical characteristics" for details. All pins have Schmitt triggered inputs. Port 3 also provides various special functions as described below: 9 I/O O O P3.0 -- Port 3 bit 0. XTAL2 -- Output from the oscillator amplifier (when a crystal oscillator option is selected via the FLASH configuration). CLKOUT -- CPU clock divided by 2 when enabled via SFR bit (ENCLK - TRIM.6). It can be used if the CPU clock is the internal RC oscillator, Watchdog oscillator or external clock input, except when XTAL1/XTAL2 are used to generate clock source for the real time clock/system timer. P3.1 -- Port 3 bit 1. XTAL1 -- Input to the oscillator circuit and internal clock generator circuits (when selected via the FLASH configuration). It can be a port pin if internal RC oscillator or Watchdog oscillator is used as the CPU clock source, and if XTAL1/XTAL2 are not used to generate the clock for the real time clock/system timer. Ground: 0 V reference. Power Supply: This is the power supply voltage for normal operation as well as Idle and Power Down modes.
8
I/O I
VSS VDD
7 21
I I
[1]
Input/Output for P1.0-P1.4, P1.6, P1.7. Input for P1.5.
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Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
6. Logic symbol
VDD VSS
CLKOUT
XTAL2 XTAL1
P89LPC930/931
KBI0 KBI1 KBI2 KBI3 KBI4 KBI5 KBI6 KBI7
CMP2 CIN2B CIN2A CIN1B CIN1A CMPREF CMP1 T1
TxD RxD T0 INT0 INT1 RST
PORT 3
PORT 0
PORT 1
SCL SDA
MOSI MISO SS SPICLK
002aaa427
Fig 3. Logic symbol.
PORT 2
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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
7. Special function registers
Remark: Special Function Registers (SFRs) accesses are restricted in the following ways:
* User must not attempt to access any SFR locations not defined. * Accesses to any defined SFR locations must be strictly for the functions for the
SFRs.
* SFR bits labeled `-', `0' or `1' can only be written and read as follows:
- `-' Unless otherwise specified, must be written with `0', but can return any value when read (even if it was written with `0'). It is a reserved bit and may be used in future derivatives. - `0' must be written with `0', and will return a `0' when read. - `1' must be written with `1', and will return a `1' when read.
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Product data Rev. 04 -- 06 January 2004
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Philips Semiconductors
Table 4: Special function registers * indicates SFRs that are bit addressable. Name Description SFR Bit functions and addresses addr. MSB Bit address ACC* AUXR1 B* BRGR0[2] BRGR1[2] BRGCON CMP1 CMP2 DIVM DPTR DPH DPL FMADRH FMADRL FMCON Accumulator Auxiliary function register B register Baud rate generator rate LOW Baud rate generator rate HIGH Baud rate generator control Comparator 1 control register Comparator 2 control register CPU clock divide-by-M control Data pointer (2 bytes) Data pointer HIGH Data pointer LOW Program Flash address HIGH Program Flash address LOW Program Flash Control (Read) Program Flash Control (Write) FMDATA I2ADR I2CON* I2DAT Program Flash data I2C slave address register E5H DBH D8H DAH I2ADR.6 DF I2ADR.5 DE I2EN I2ADR.4 DD STA I2ADR.3 DC STO I2ADR.2 DB SI I2ADR.1 DA AA I2ADR.0 D9 GC D8 CRSEL 00 x00000x0 Bit address I2C control register I2C data register 83H 82H E7H E6H E4H BUSY FMCMD. 7 FMCMD. 6 FMCMD. 5 FMCMD. 4 HVA FMCMD. 3 HVE FMCMD. 2 SV FMCMD. 1 OI FMCMD. 0 00 00 00000000 00000000 00 00 00 00 70 00000000 00000000 00000000 00000000 01110000 E0H A2H F0H BEH BFH BDH ACH ADH 95H CE1 CE2 CP1 CP2 CN1 CN2 OE1 OE2 SBRGS CO1 CO2 BRGEN CMF1 CMF2 CLKLP F7 EBRR F6 ENT1 F5 ENT0 F4 SRST F3 0 F2 F1 DPS F0 00 00 00 00[6] 00[1] 00[1] 00 00000000 00000000 00000000 xxxxxx00 xx000000 xx000000 00000000 E7 E6 E5 E4 E3 E2 E1 Reset value LSB E0 00 00[1] 00000000 000000x0 Hex Binary
Bit address
8-bit microcontrollers with two-clock 80C51 core
P89LPC930/931
12 of 54
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Table 4: Special function registers...continued * indicates SFRs that are bit addressable. Name I2SCLH I2SCLL I2STAT IEN0* IEN1*
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Description Serial clock generator/SCL duty cycle register HIGH Serial clock generator/SCL duty cycle register LOW I2C status register Interrupt enable 0 Interrupt enable 1 Interrupt priority 0 Interrupt priority 0 HIGH
SFR Bit functions and addresses addr. MSB DDH DCH D9H Bit address A8H Bit address E8H Bit address B8H B7H Bit address STA.4 AF EA EF BF FF STA.3 AE EWDRT EE EST BE PWDRT PWDRT H FE PST PSTH STA.2 AD EBO ED BD PBO PBOH FD STA.1 AC ES/ESR EC BC PS/PSR PSH/ PSRH FC STA.0 AB ET1 EB ESPI BB PT1 PT1H FB PSPI PSPIH 0 AA EX1 EA EC BA PX1 PX1H FA PC PCH 0 A9 ET0 E9 EKBI B9 PT0 PT0H F9 PKBI PKBIH PATN _SEL
Reset value LSB Hex 00 00 0 A8 EX0 E8 EI2C B8 PX0 PX0H F8 PI2C PI2CH KBIF 00[1] 00[1] 00[1] 00 FF 00x00000 00[1] 00[1] x0000000 x0000000 00[1] 00x00000 00 00000000 F8 Binary 00000000 00000000 11111000
IP0* IP0H
IP1* IP1H KBCON KBMASK KBPATN P0*
Interrupt priority 1 Interrupt priority 1 HIGH Keypad control register Keypad interrupt mask register Keypad pattern register Port 0
F8H F7H 94H 86H 93H Bit address 80H Bit address
8-bit microcontrollers with two-clock 80C51 core
00x00000 xxxxxx00 00000000 11111111
[1]
P89LPC930/931
87 T1/KB7 97 A7 B7 -
86 CMP1 /KB6 96 A6 B6 -
85 CMPREF /KB5 95 RST A5 SPICLK B5 -
84 CIN1A /KB4 94 INT1 A4 SS B4 -
83 CIN1B /KB3 93 INT0/ SDA A3 MISO B3 -
82 CIN2A /KB2 92 T0/SCL A2 MOSI B2 -
81 CIN2B /KB1 91 RXD A1 B1 XTAL1
80 CMP2 /KB0 90 TXD A0 B0 XTAL2
[1] [1] [1]
P1*
Port 1
90H Bit address
P2* P3*
Port 2 Port 3
A0H Bit address B0H
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Table 4: Special function registers...continued * indicates SFRs that are bit addressable. Name P0M1 P0M2 P1M1 P1M2 P2M1 P2M2 P3M1 P3M2 PCON PCONA PSW* PT0AD RSTSRC RTCCON RTCH RTCL SADDR SADEN SBUF SCON* SSTAT SP SPCTL SPSTAT SPDAT
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Description Port 0 output mode 1 Port 0 output mode 2 Port 1 output mode 1 Port 1 output mode 2 Port 2 output mode 1 Port 2 output mode 2 Port 3 output mode 1 Port 3 output mode 2 Power control register Power control register A Program status word Port 0 digital input disable Reset source register Real-time clock control Real-time clock register HIGH Real-time clock register LOW Serial port address register Serial port address enable Serial port data buffer register Serial port control Serial port extended status register Stack pointer SPI Control Register SPI Status Register SPI Data Register
SFR Bit functions and addresses addr. MSB 84H 85H 91H 92H A4H A5H B1H B2H 87H B5H Bit address D0H F6H DFH D1H D2H D3H A9H B9H 99H 9F SM0/FE DBMOD 9E SM1 INTLO 9D SM2 CIDIS 9C REN DBISEL 9B TB8 FE 9A RB8 BR 99 TI OE
Reset value LSB Hex Binary 11111111 00000000 11x1xx11 00x0xx00 11111111 00000000 xxxxxx11 xxxxxx00 00000000 00000000 00000000 xx00000x
[3]
(P0M1.7) (P0M1.6) (P0M1.5) (P0M1.4) (P0M1.3) (P0M1.2) (P0M1.1) (P0M1.0) FF (P0M2.7) (P0M2.6) (P0M2.5) (P0M2.4) (P0M2.3) (P0M2.2) (P0M2.1) (P0M2.0) 00 (P1M1.7) (P1M1.6) (P1M2.7) (P1M2.6) (P1M1.4) (P1M1.3) (P1M1.2) (P1M1.1) (P1M1.0) (P1M2.4) (P1M2.3) (P1M2.2) (P1M2.1) (P1M2.0) D3[1] 00[1] FF[1] 03[1] 00[1] 00 00[1] 00 00 60[1]
[6]
(P2M1.7) (P2M1.6) (P2M1.5) (P2M1.4) (P2M1.3) (P2M1.2) (P2M1.1) (P2M1.0) SMOD1 RTCPD D7 CY RTCF SMOD0 D6 AC RTCS1 BOPD VCPD D5 F0 PT0AD.5 BOF RTCS0 BOI D4 RS1 PT0AD.4 POF GF1 I2PD D3 RS0 PT0AD.3 R_BK GF0 SPPD D2 OV PT0AD.2 R_WD (P3M1.1) (P3M1.0) (P3M2.1) (P3M2.0) PMOD1 SPD D1 F1 PT0AD.1 R_SF ERTC PMOD0 D0 P R_EX RTCEN
(P2M2.7) (P2M2.6) (P2M2.5) (P2M2.4) (P2M2.3) (P2M2.2) (P2M2.1) (P2M2.0) 00
8-bit microcontrollers with two-clock 80C51 core
011xxx00 00000000 00000000 00000000 00000000 xxxxxxxx 00000000 00000000 00000111 00000100 00xxxxxx 00000000
00[6] 00[6] 00 00 xx 98 RI STINT 00 00 07 SSIG SPIF SPEN WCOL DORD MSTR CPOL CPHA SPR1 SPR0 04 00 00
P89LPC930/931
Bit address 98H BAH 81H E2H E1H E3H
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Table 4: Special function registers...continued * indicates SFRs that are bit addressable. Name TAMOD TCON* TH0 TH1 TL0 TL1 TMOD TRIM WDCON WDL WFEED1 WFEED2
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Description Timer 0 and 1 auxiliary mode Timer 0 and 1 control Timer 0 HIGH Timer 1 HIGH Timer 0 LOW Timer 1 LOW Timer 0 and 1 mode Internal oscillator trim register Watchdog control register Watchdog load Watchdog feed 1 Watchdog feed 2
SFR Bit functions and addresses addr. MSB 8FH 88H 8CH 8DH 8AH 8BH 89H 96H A7H C1H C2H C3H T1GATE PRE2 T1C/T ENCLK PRE1 T1M1 TRIM.5 PRE0 T1M0 TRIM.4 T0GATE TRIM.3 T0C/T TRIM.2 WDRUN T0M1 TRIM.1 WDTOF 8F TF1 8E TR1 8D TF0 T1M2 8C TR0 8B IE1 8A IT1 89 IE0 Bit address
Reset value LSB T0M2 88 IT0 00 00 00 00 00 T0M0 TRIM.0 WDCLK FF 00 00000000 00000000 00000000 00000000 00000000 00000000
[5] [6] [4] [6]
Hex 00
Binary xxx0xxx0
11111111
[3] [4] [5] [6]
All ports are in input only (high impedance) state after power-up. BRGR1 and BRGR0 must only be written if BRGEN in BRGCON SFR is `0'. If any are written while BRGEN = 1, the result is unpredictable. Unimplemented bits in SFRs (labeled '-') are X (unknown) at all times. Unless otherwise specified, ones should not be written to these bits since they may be used for other purposes in future derivatives. The reset values shown for these bits are '0's although they are unknown when read. The RSTSRC register reflects the cause of the P89LPC930/931 reset. Upon a power-up reset, all reset source flags are cleared except POF and BOF; the power-on reset value is xx110000. After reset, the value is 111001x1, i.e., PRE2-PRE0 are all `1', WDRUN = 1 and WDCLK = 1. WDTOF bit is `1' after Watchdog reset and is `0' after power-on reset. Other resets will not affect WDTOF. On power-on reset, the TRIM SFR is initialized with a factory preprogrammed value. Other resets will not cause initialization of the TRIM register. The only reset source that affects these SFRs is power-on reset.
8-bit microcontrollers with two-clock 80C51 core
P89LPC930/931
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
8. Functional description
Remark: Please refer to the P89LPC930/931 User's Manual for a more detailed functional description.
8.1 Enhanced CPU
The P89LPC930/931 uses an enhanced 80C51 CPU which runs at 6 times the speed of standard 80C51 devices. A machine cycle consists of two CPU clock cycles, and most instructions execute in one or two machine cycles.
8.2 Clocks
8.2.1 Clock definitions The P89LPC930/931 device has several internal clocks as defined below: OSCCLK -- Input to the DIVM clock divider. OSCCLK is selected from one of four clock sources (see Figure 4) and can also be optionally divided to a slower frequency (see Section 8.7 "CPU CLOCK (CCLK) modification: DIVM register"). Note: fOSC is defined as the OSCCLK frequency. CCLK -- CPU clock; output of the clock divider. There are two CCLK cycles per machine cycle, and most instructions are executed in one to two machine cycles (two or four CCLK cycles). RCCLK -- The internal 7.373 MHz RC oscillator output. PCLK -- Clock for the various peripheral devices and is CCLK/2 8.2.2 CPU clock (OSCCLK) The P89LPC930/931 provides several user-selectable oscillator options in generating the CPU clock. This allows optimization for a range of needs from high precision to lowest possible cost. These options are configured when the FLASH is programmed and include an on-chip Watchdog oscillator, an on-chip RC oscillator, an oscillator using an external crystal, or an external clock source. The crystal oscillator can be optimized for low, medium, or high frequency crystals covering a range from 20 kHz to 12 MHz. 8.2.3 Low speed oscillator option This option supports an external crystal in the range of 20 kHz to 100 kHz. Ceramic resonators are also supported in this configuration. 8.2.4 Medium speed oscillator option This option supports an external crystal in the range of 100 kHz to 4 MHz. Ceramic resonators are also supported in this configuration. 8.2.5 High speed oscillator option This option supports an external crystal in the range of 4 MHz to 12 MHz. Ceramic resonators are also supported in this configuration.
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8.2.6
Clock output The P89LPC930/931 supports a user-selectable clock output function on the XTAL2/CLKOUT pin when crystal oscillator is not being used. This condition occurs if another clock source has been selected (on-chip RC oscillator, Watchdog oscillator, external clock input on X1) and if the Real-Time clock is not using the crystal oscillator as its clock source. This allows external devices to synchronize to the P89LPC930/931. This output is enabled by the ENCLK bit in the TRIM register. The frequency of this clock output is 12 that of the CCLK. If the clock output is not needed in Idle mode, it may be turned off prior to entering Idle, saving additional power.
8.3 On-chip RC oscillator option
The P89LPC930/931 has a 6-bit TRIM register that can be used to tune the frequency of the RC oscillator. During reset, the TRIM value is initialized to a factory pre-programmed value to adjust the oscillator frequency to 7.373 MHz, 1% at room temperature. End-user applications can write to the Trim register to adjust the on-chip RC oscillator to other frequencies.
8.4 Watchdog oscillator option
The watchdog has a separate oscillator which has a frequency of 400 kHz. This oscillator can be used to save power when a high clock frequency is not needed.
8.5 External clock input option
In this configuration, the processor clock is derived from an external source driving the XTAL1/P3.1 pin. The rate may be from 0 Hz up to 12 MHz. The XTAL2/P3.0 pin may be used as a standard port pin or a clock output.
XTAL1 XTAL2
High freq. Med. freq. Low freq. OSCCLK CCLK
RTC
DIVM
CPU
RC OSCILLATOR (7.3728 MHz) WATCHDOG OSCILLATOR (400 kHz) PCLK
2
WDT
SPI
TIMER 0 and TIMER 1
I2C
BAUD RATE GENERATOR
UART
002aaa431
Fig 4. Block diagram of oscillator control.
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8.6 CPU CLock (CCLK) wake-up delay
The P89LPC930/931 has an internal wake-up timer that delays the clock until it stabilizes depending to the clock source used. If the clock source is any of the three crystal selections (low, medium and high frequencies) the delay is 992 OSCCLK cycles plus 60 to 100 s. If the clock source is either the internal RC oscillator, Watchdog oscillator, or external clock, the delay is 224 OSCCLK cycles plus 60 to 100 s.
8.7 CPU CLOCK (CCLK) modification: DIVM register
The OSCCLK frequency can be divided down up to 256 times by configuring a dividing register, DIVM, to generate CCLK. This feature makes it possible to temporarily run the CPU at a lower rate, reducing power consumption. By dividing the clock, the CPU can retain the ability to respond to events that would not exit Idle mode by executing its normal program at a lower rate. This can also allow bypassing the oscillator start-up time in cases where Power-down mode would otherwise be used. The value of DIVM may be changed by the program at any time without interrupting code execution.
8.8 Low power select
The P89LPC930/931 is designed to run at 12 MHz (CCLK) maximum. However, if CCLK is 8 MHz or slower, the CLKLP SFR bit (AUXR1.7) can be set to `1' to lower the power consumption further. On any reset, CLKLP is `0' allowing highest performance access. This bit can then be set in software if CCLK is running at 8 MHz or slower.
8.9 Memory organization
The various P89LPC930/931 memory spaces are as follows:
* DATA
128 bytes of internal data memory space (00h:7Fh) accessed via direct or indirect addressing, using instruction other than MOVX and MOVC. All or part of the Stack may be in this area.
* IDATA
Indirect Data. 256 bytes of internal data memory space (00h:FFh) accessed via indirect addressing using instructions other than MOVX and MOVC. All or part of the Stack may be in this area. This area includes the DATA area and the 128 bytes immediately above it.
* SFR
Special Function Registers. Selected CPU registers and peripheral control and status registers, accessible only via direct addressing.
* CODE
64 kB of Code memory space, accessed as part of program execution and via the MOVC instruction. The P89LPC930/931 has 4 kB/ 8 kB of on-chip Code memory.
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8.10 Interrupts
The P89LPC930/931 uses a four priority level interrupt structure. This allows great flexibility in controlling the handling of the many interrupt sources. The P89LPC930/931 supports 13 interrupt sources: external interrupts 0 and 1, timers 0 and 1, serial port Tx, serial port Rx, combined serial port Rx/Tx, brownout detect, watchdog/real-time clock, I2C, keyboard, and comparators 1 and 2, and SPI. Each interrupt source can be individually enabled or disabled by setting or clearing a bit in the interrupt enable registers IEN0 or IEN1. The IEN0 register also contains a global disable bit, EA, which disables all interrupts. Each interrupt source can be individually programmed to one of four priority levels by setting or clearing bits in the interrupt priority registers IP0, IP0H, IP1, and IP1H. An interrupt service routine in progress can be interrupted by a higher priority interrupt, but not by another interrupt of the same or lower priority. The highest priority interrupt service cannot be interrupted by any other interrupt source. If two requests of different priority levels are pending at the start of an instruction, the request of higher priority level is serviced. If requests of the same priority level are pending at the start of an instruction, an internal polling sequence determines which request is serviced. This is called the arbitration ranking. Note that the arbitration ranking is only used to resolve pending requests of the same priority level. 8.10.1 External interrupt inputs The P89LPC930/931 has two external interrupt inputs as well as the Keypad Interrupt function. The two interrupt inputs are identical to those present on the standard 80C51 microcontrollers. These external interrupts can be programmed to be level-triggered or edge-triggered by setting or clearing bit IT1 or IT0 in Register TCON. In edge-triggered mode if successive samples of the INTn pin show a HIGH in one cycle and a LOW in the next cycle, the interrupt request flag IEn in TCON is set, causing an interrupt request. If an external interrupt is enabled when the P89LPC930/931 is put into Power-down or Idle mode, the interrupt will cause the processor to wake-up and resume operation. Refer to Section 8.13 "Power reduction modes" for details.
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IE0 EX0 IE1 EX1 BOPD EBO RTCF ERTC (RTCCON.1) WDOVF KBIF EKBI EWDRT CMF2 CMF1 EC EA (IE0.7) TF0 ET0 TF1 ET1 TI & RI/RI ES/ESR TI EST SI EI2C SPIF ESPI
002aaa432
WAKE-UP (IF IN POWER-DOWN)
INTERRUPT TO CPU
Fig 5. Interrupt sources, interrupt enables, and power-down wake-up sources.
8.11 I/O ports
The P89LPC930/931 has four I/O ports: Port 0, Port 1, Port 2, and Port 3. Ports 0, 1 and 2 are 8-bit ports, and Port 3 is a 2-bit port. The exact number of I/O pins available depend upon the clock and reset options chosen, as shown in Table 5.
Table 5: Number of I/O pins available Reset option No external reset (except during power-up) External RST pin supported External clock input Low/medium/high speed oscillator (external crystal or resonator) No external reset (except during power-up) External RST pin supported No external reset (except during power-up) External RST pin supported Number of I/O pins (20-pin package) 26 25 25 24 24 23
Clock source On-chip oscillator or Watchdog oscillator
8.11.1
Port configurations All but three I/O port pins on the P89LPC930/931 may be configured by software to one of four types on a bit-by-bit basis. These are: quasi-bidirectional (standard 80C51 port outputs), push-pull, open drain, and input-only. Two configuration registers for each port select the output type for each port pin. P1.5 (RST) can only be an input and cannot be configured.
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P1.2 (SCL/T0) and P1.3 (SDA/INT0) may only be configured to be either input-only or open-drain. 8.11.2 Quasi-bidirectional output configuration Quasi-bidirectional outputs can be used as both an input and output without the need to reconfigure the port. This is possible because when the port outputs a logic HIGH, it is weakly driven, allowing an external device to pull the pin LOW. When the pin is driven LOW, it is driven strongly and able to sink a fairly large current. These features are somewhat similar to an open-drain output except that there are three pull-up transistors in the quasi-bidirectional output that serve different purposes. The P89LPC930/931 is a 3 V device, but the pins are 5 V-tolerant. In quasi-bidirectional mode, if a user applies 5 V on the pin, there will be a current flowing from the pin to VDD, causing extra power consumption. Therefore, applying 5 V in quasi-bidirectional mode is discouraged. A quasi-bidirectional port pin has a Schmitt-triggered input that also has a glitch suppression circuit. 8.11.3 Open-drain output configuration The open-drain output configuration turns off all pull-ups and only drives the pull-down transistor of the port driver when the port latch contains a logic `0'. To be used as a logic output, a port configured in this manner must have an external pull-up, typically a resistor tied to VDD. An open-drain port pin has a Schmitt-triggered input that also has a glitch suppression circuit. 8.11.4 Input-only configuration The input-only port configuration has no output drivers. It is a Schmitt-triggered input that also has a glitch suppression circuit. 8.11.5 Push-pull output configuration The push-pull output configuration has the same pull-down structure as both the open-drain and the quasi-bidirectional output modes, but provides a continuous strong pull-up when the port latch contains a logic `1'. The push-pull mode may be used when more source current is needed from a port output. A push-pull port pin has a Schmitt-triggered input that also has a glitch suppression circuit. 8.11.6 Port 0 analog functions The P89LPC930/931 incorporates two Analog Comparators. In order to give the best analog function performance and to minimize power consumption, pins that are being used for analog functions must have the digital outputs and digital inputs disabled. Digital outputs are disabled by putting the port output into the Input-Only (high impedance) mode as described in Section 8.11.4. Digital inputs on Port 0 may be disabled through the use of the PT0AD register, bits 1:5. On any reset, PT0AD1:5 defaults to `0's to enable digital functions.
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8.11.7
Additional port features After power-up, all pins are in Input-Only mode. Please note that this is different from the LPC76x series of devices.
* After power-up, all I/O pins except P1.5, may be configured by software. * Pin P1.5 is input only. Pins P1.2 and P1.3 and are configurable for either input-only
or open-drain. Every output on the P89LPC930/931 has been designed to sink typical LED drive current. However, there is a maximum total output current for all ports which must not be exceeded. Please refer to Table 7 "DC electrical characteristics" for detailed specifications. All ports pins that can function as an output have slew rate controlled outputs to limit noise generated by quickly switching output signals. The slew rate is factory-set to approximately 10 ns rise and fall times.
8.12 Power monitoring functions
The P89LPC930/931 incorporates power monitoring functions designed to prevent incorrect operation during initial power-up and power loss or reduction during operation. This is accomplished with two hardware functions: Power-on Detect and Brownout detect. 8.12.1 Brownout detection The Brownout detect function determines if the power supply voltage drops below a certain level. The default operation is for a Brownout detection to cause a processor reset, however it may alternatively be configured to generate an interrupt. Brownout detection may be enabled or disabled in software. If Brownout detection is enabled, the operating voltage range for VDD is 2.7 V to 3.6 V, and the brownout condition occurs when VDD falls below the brownout trip voltage, VBO (see Table 7 "DC electrical characteristics"), and is negated when VDD rises above VBO. If brownout detection is disabled, the operating voltage range for VDD is 2.4 V to 3.6 V. If the P89LPC930/931 device is to operate with a power supply that can be below 2.7 V, BOE should be left in the unprogrammed state so that the device can operate at 2.4 V, otherwise continuous brownout reset may prevent the device from operating. For correct activation of Brownout detect, the VDD rise and fall times must be observed. Please see Table 7 "DC electrical characteristics" for specifications. 8.12.2 Power-on detection The Power-on Detect has a function similar to the Brownout detect, but is designed to work as power comes up initially, before the power supply voltage reaches a level where Brownout detect can work. The POF flag in the RSTSRC register is set to indicate an initial power-up condition. The POF flag will remain set until cleared by software.
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8.13 Power reduction modes
The P89LPC930/931 supports three different power reduction modes. These modes are Idle mode, Power-down mode, and total Power-down mode. 8.13.1 Idle mode Idle mode leaves peripherals running in order to allow them to activate the processor when an interrupt is generated. Any enabled interrupt source or reset may terminate Idle mode. 8.13.2 Power-down mode The Power-down mode stops the oscillator in order to minimize power consumption. The P89LPC930/931 exits Power-down mode via any reset, or certain interrupts. In Power-down mode, the power supply voltage may be reduced to the RAM keep-alive voltage VRAM. This retains the RAM contents at the point where Power-down mode was entered. SFR contents are not guaranteed after VDD has been lowered to VRAM, therefore it is highly recommended to wake up the processor via reset in this case. VDD must be raised to within the operating range before the Power-down mode is exited. Some chip functions continue to operate and draw power during Power-down mode, increasing the total power used during Power-down. These include: Brownout detect, Watchdog Timer, Comparators (note that Comparators can be powered-down separately), and Real-Time Clock (RTC)/System Timer. The internal RC oscillator is disabled unless both the RC oscillator has been selected as the system clock and the RTC is enabled. 8.13.3 Total Power-down mode This is the same as Power-down mode except that the brownout detection circuitry and the voltage comparators are also disabled to conserve additional power. The internal RC oscillator is disabled unless both the RC oscillator has been selected as the system clock and the RTC is enabled. If the internal RC oscillator is used to clock the RTC during Power-down, there will be high power consumption. Please use an external low frequency clock to achieve low power with the Real-Time Clock running during Power-down.
8.14 Reset
The P1.5/RST pin can function as either an active-LOW reset input or as a digital input, P1.5. The RPE (Reset Pin Enable) bit in UCFG1, when set to `1', enables the external reset input function on P1.5. When cleared, P1.5 may be used as an input pin. Remark: During a power-up sequence, the RPE selection is overridden and this pin will always function as a reset input. An external circuit connected to this pin should not hold this pin LOW during a power-on sequence as this will keep the device in reset. After power-up this input will function either as an external reset input or as a digital input as defined by the RPE bit. Only a power-up reset will temporarily override the selection defined by RPE bit. Other sources of reset will not override the RPE bit.
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Remark: During a power cycle, VDD must fall below VPOR (see Table 7 "DC electrical characteristics" on page 40) before power is reapplied, in order to ensure a power-on reset. Reset can be triggered from the following sources:
* * * * * *
External reset pin (during power-up or if user configured via UCFG1) Power-on detect Brownout detect Watchdog Timer Software reset UART break character detect reset
For every reset source, there is a flag in the Reset Register, RSTSRC. The user can read this register to determine the most recent reset source. These flag bits can be cleared in software by writing a `0' to the corresponding bit. More than one flag bit may be set:
* During a power-on reset, both POF and BOF are set but the other flag bits are
cleared.
* For any other reset, previously set flag bits that have not been cleared will remain
set. 8.14.1 Reset vector Following reset, the P89LPC930/931 will fetch instructions from either address 0000h or the Boot address. The Boot address is formed by using the Boot Vector as the high byte of the address and the low byte of the address = 00h. The Boot address will be used if a UART break reset occurs, or the non-volatile Boot Status bit (BOOTSTAT.0) = 1, or the device is forced into ISP mode during power-on (see P89LPC930/931 User's Manual). Otherwise, instructions will be fetched from address 0000H.
8.15 Timers/counters 0 and 1
The P89LPC930/931 has two general purpose counter/timers which are upward compatible with the standard 80C51 Timer 0 and Timer 1. Both can be configured to operate either as timers or event counter. An option to automatically toggle the T0 and/or T1 pins upon timer overflow has been added. In the `Timer' function, the register is incremented every machine cycle. In the `Counter' function, the register is incremented in response to a 1-to-0 transition at its corresponding external input pin, T0 or T1. In this function, the external input is sampled once during every machine cycle. Timer 0 and Timer 1 have five operating modes (modes 0, 1, 2, 3 and 6). Modes 0, 1, 2 and 6 are the same for both Timers/Counters. Mode 3 is different.
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8.15.1
Mode 0 Putting either Timer into Mode 0 makes it look like an 8048 Timer, which is an 8-bit Counter with a divide-by-32 prescaler. In this mode, the Timer register is configured as a 13-bit register. Mode 0 operation is the same for Timer 0 and Timer 1.
8.15.2
Mode 1 Mode 1 is the same as Mode 0, except that all 16 bits of the timer register are used.
8.15.3
Mode 2 Mode 2 configures the Timer register as an 8-bit Counter with automatic reload. Mode 2 operation is the same for Timer 0 and Timer 1.
8.15.4
Mode 3 When Timer 1 is in Mode 3 it is stopped. Timer 0 in Mode 3 forms two separate 8-bit counters and is provided for applications that require an extra 8-bit timer. When Timer 1 is in Mode 3 it can still be used by the serial port as a baud rate generator.
8.15.5
Mode 6 In this mode, the corresponding timer can be changed to a PWM with a full period of 256 timer clocks.
8.15.6
Timer overflow toggle output Timers 0 and 1 can be configured to automatically toggle a port output whenever a timer overflow occurs. The same device pins that are used for the T0 and T1 count inputs are also used for the timer toggle outputs. The port outputs will be a logic `1' prior to the first timer overflow when this mode is turned on.
8.16 Real-Time clock/system timer
The P89LPC930/931 has a simple Real-Time clock that allows a user to continue running an accurate timer while the rest of the device is powered-down. The Real-Time clock can be a wake-up or an interrupt source. The Real-Time clock is a 23-bit down counter comprised of a 7-bit prescaler and a 16-bit loadable down counter. When it reaches all `0's, the counter will be reloaded again and the RTCF flag will be set. The clock source for this counter can be either the CPU clock (CCLK) or the XTAL oscillator, provided that the XTAL oscillator is not being used as the CPU clock. If the XTAL oscillator is used as the CPU clock, then the RTC will use CCLK as its clock source. Only power-on reset will reset the Real-Time clock and its associated SFRs to the default state.
8.17 UART
The P89LPC930/931 has an enhanced UART that is compatible with the conventional 80C51 UART except that Timer 2 overflow cannot be used as a baud rate source. The P89LPC930/931 does include an independent Baud Rate Generator. The baud rate can be selected from the oscillator (divided by a constant), Timer 1 overflow, or the independent Baud Rate Generator. In addition to the baud rate generation, enhancements over the standard 80C51 UART include Framing Error detection, automatic address recognition, selectable double buffering and several interrupt options. The UART can be operated in 4 modes: shift register, 8-bit UART, 9-bit UART, and CPU clock/32 or CPU clock/16.
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8.17.1
Mode 0 Serial data enters and exits through RxD. TxD outputs the shift clock. 8 bits are transmitted or received, LSB first. The baud rate is fixed at 116 of the CPU clock frequency.
8.17.2
Mode 1 10 bits are transmitted (through TxD) or received (through RxD): a start bit (logic `0'), 8 data bits (LSB first), and a stop bit (logic `1'). When data is received, the stop bit is stored in RB8 in Special Function Register SCON. The baud rate is variable and is determined by the Timer 1 overflow rate or the Baud Rate Generator (described in Section 8.17.5 "Baud rate generator and selection").
8.17.3
Mode 2 11 bits are transmitted (through TxD) or received (through RxD): start bit (logic `0'), 8 data bits (LSB first), a programmable 9th data bit, and a stop bit (logic `1'). When data is transmitted, the 9th data bit (TB8 in SCON) can be assigned the value of `0' or `1'. Or, for example, the parity bit (P, in the PSW) could be moved into TB8. When data is received, the 9th data bit goes into RB8 in Special Function Register SCON, while the stop bit is not saved. The baud rate is programmable to either 116 or 132 of the CPU clock frequency, as determined by the SMOD1 bit in PCON.
8.17.4
Mode 3 11 bits are transmitted (through TxD) or received (through RxD): a start bit (logic `0'), 8 data bits (LSB first), a programmable 9th data bit, and a stop bit (logic `1'). In fact, Mode 3 is the same as Mode 2 in all respects except baud rate. The baud rate in Mode 3 is variable and is determined by the Timer 1 overflow rate or the Baud Rate Generator (described in section Section 8.17.5 "Baud rate generator and selection").
8.17.5
Baud rate generator and selection The P89LPC930/931 enhanced UART has an independent Baud Rate Generator. The baud rate is determined by a baud-rate preprogrammed into the BRGR1 and BRGR0 SFRs which together form a 16-bit baud rate divisor value that works in a similar manner as Timer 1. If the baud rate generator is used, Timer 1 can be used for other timing functions. The UART can use either Timer 1 or the baud rate generator output (see Figure 6). Note that Timer T1 is further divided by 2 if the SMOD1 bit (PCON.7) is cleared. The independent Baud Rate Generator uses OSCCLK.
Timer 1 Overflow (PCLK-based) Baud Rate Generator (CCLK-based)
SMOD1 = 1
SBRGS = 0 Baud Rate Modes 1 and 3
2
SMOD1 = 0
SBRGS = 1
002aaa419
Fig 6. Baud rate sources for UART (Modes 1, 3).
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8.17.6
Framing error Framing error is reported in the status register (SSTAT). In addition, if SMOD0 (PCON.6) is `1', framing errors can be made available in SCON.7 respectively. If SMOD0 is `0', SCON.7 is SM0. It is recommended that SM0 and SM1 (SCON.7:6) are set up when SMOD0 is `0'.
8.17.7
Break detect Break detect is reported in the status register (SSTAT). A break is detected when 11 consecutive bits are sensed LOW. The break detect can be used to reset the device and force the device into ISP mode.
8.17.8
Double buffering The UART has a transmit double buffer that allows buffering of the next character to be written to SBUF while the first character is being transmitted. Double buffering allows transmission of a string of characters with only one stop bit between any two characters, as long as the next character is written between the start bit and the stop bit of the previous character. Double buffering can be disabled. If disabled (DBMOD, i.e., SSTAT.7 = `0'), the UART is compatible with the conventional 80C51 UART. If enabled, the UART allows writing to SnBUF while the previous data is being shifted out. Double buffering is only allowed in Modes 1, 2 and 3. When operated in Mode 0, double buffering must be disabled (DBMOD = `0').
8.17.9
Transmit interrupts with double buffering enabled (Modes 1, 2 and 3) Unlike the conventional UART, in double buffering mode, the Tx interrupt is generated when the double buffer is ready to receive new data.
8.17.10
The 9th bit (bit 8) in double buffering (Modes 1, 2 and 3) If double buffering is disabled TB8 can be written before or after SBUF is written, as long as TB8 is updated some time before that bit is shifted out. TB8 must not be changed until the bit is shifted out, as indicated by the Tx interrupt. If double buffering is enabled, TB8 must be updated before SBUF is written, as TB8 will be double-buffered together with SBUF data.
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8.18 I2C-bus serial interface
I2C-bus uses two wires (SDA and SCL) to transfer information between devices connected to the bus, and it has the following features:
* Bidirectional data transfer between masters and slaves. * Multimaster bus (no central master). * Arbitration between simultaneously transmitting masters without corruption of
serial data on the bus.
* Serial clock synchronization allows devices with different bit rates to communicate
via one serial bus.
* Serial clock synchronization can be used as a handshake mechanism to suspend
and resume serial transfer.
* The I2C-bus may be used for test and diagnostic purposes.
A typical I2C-bus configuration is shown in Figure 7. The P89LPC930/931 device provides a byte-oriented I2C-bus interface that supports data transfers up to 400 kHz.
RP
RP SDA
I2C-BUS SCL P1.3/SDA P1.2/SCL OTHER DEVICE WITH I2C-BUS INTERFACE OTHER DEVICE WITH I2C-BUS INTERFACE
002aaa433
P89LPC930/931
Fig 7. I2C-bus configuration.
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8
ADDRESS REGISTER P1.3
I2ADR
COMPARATOR INPUT FILTER P1.3/SDA OUTPUT STAGE SHIFT REGISTER 8 ACK I2DAT
INPUT FILTER P1.2/SCL OUTPUT STAGE TIMER 1 OVERFLOW P1.2 I2CON I2SCLH I2SCLL
BIT COUNTER / ARBITRATION & SYNC LOGIC
CCLK TIMING & CONTROL LOGIC INTERRUPT
SERIAL CLOCK GENERATOR
CONTROL REGISTERS & SCL DUTY CYCLE REGISTERS 8
STATUS BUS
STATUS DECODER
I2STAT
STATUS REGISTER
8
002aaa421
Fig 8. I2C-bus serial interface block diagram.
8.19 Serial Peripheral Interface (SPI)
LPC930/931 provides another high-speed serial communication interface - the SPI interface. SPI is a full-duplex, high-speed, synchronous communication bus with two operation modes: Master mode and Slave mode. Up to 3 Mbit/s can be supported in either Master or Slave mode. It has a Transfer Completion Flag and Write Collision Flag Protection.
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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
S M PIN CONTROL LOGIC CPU clock 8-BIT SHIFT REGISTER DIVIDER BY 4, 16, 64, 128 READ DATA BUFFER M S
MISO P2.3 MOSI P2.2 SPICLK P2.5 SS P2.4 SPEN
SPI clock (master) SELECT SPR1 SPR0
clock CLOCK LOGIC S M MSTR DORD MSTR CPHA SPEN CPOL SPR1 SSIG SPI CONTROL REGISTER internal data bus SPR0
SPI CONTROL WCOL SPIF
MSTR SPEN
SPI STATUS REGISTER
SPI interrupt request
002aaa434
Fig 9. SPI block diagram.
The SPI interface has four pins: SPICLK, MOSI, MISO, and SS:
* SPICLK, MOSI and MISO are typically tied together between two or more SPI
devices. Data flows from master to slave on MOSI (Master Out Slave In) pin and flows from slave to master on MISO (Master In Slave Out) pin. The SPICLK signal is output in the master mode and is input in the slave mode. If the SPI system is disabled, i.e. SPEN (SPCTL.6) = 0 (reset value), these pins are configured for port functions.
* SS is the optional slave select pin. In a typical configuration, an SPI master asserts
one of its port pins to select one SPI device as the current slave. An SPI slave device uses its SS pin to determine whether it is selected. Typical connections are shown in Figures 10, 11, and 12.
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8.19.1
Typical SPI configurations
Master MISO 8-BIT SHIFT REGISTER MOSI MISO MOSI
Slave
8-BIT SHIFT REGISTER
SPICLK SPI CLOCK GENERATOR PORT
SPICLK SS
002aaa435
Fig 10. SPI single master single slave configuration.
Master MISO 8-BIT SHIFT REGISTER MOSI MISO MOSI
Slave
8-BIT SHIFT REGISTER
SPICLK SPI CLOCK GENERATOR SS
SPICLK SS SPI CLOCK GENERATOR
002aaa436
Fig 11. SPI dual device configuration, where either can be a master or a slave.
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Master MISO 8-BIT SHIFT REGISTER MOSI MISO MOSI
Slave
8-BIT SHIFT REGISTER
SPICLK SPI CLOCK GENERATOR port
SPICLK SS
Slave MISO MOSI 8-BIT SHIFT REGISTER
SPICLK port SS
002aaa437
Fig 12. SPI single master multiple slaves configuration.
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8.20 Analog comparators
Two analog comparators are provided on the P89LPC930/931. Input and output options allow use of the comparators in a number of different configurations. Comparator operation is such that the output is a logic 1 (which may be read in a register and/or routed to a pin) when the positive input (one of two selectable pins) is greater than the negative input (selectable from a pin or an internal reference voltage). Otherwise the output is a `0'. Each comparator may be configured to cause an interrupt when the output value changes. The overall connections to both comparators are shown in Figure 13. The comparators function to VDD = 2.4 V. When each comparator is first enabled, the comparator output and interrupt flag are not guaranteed to be stable for 10 microseconds. The corresponding comparator interrupt should not be enabled during that time, and the comparator interrupt flag must be cleared before the interrupt is enabled in order to prevent an immediate interrupt service. When a comparator is disabled the comparator's output, COx, goes HIGH. If the comparator output was LOW and then is disabled, the resulting transition of the comparator output from a LOW to HIGH state will set the comparator flag, CMFx. This will cause an interrupt if the comparator interrupt is enabled. The user should therefore disable the comparator interrupt prior to disabling the comparator. Additionally, the user should clear the comparator flag, CMFx, after disabling the comparator.
CP1 (P0.4) CIN1A (P0.3) CIN1B (P0.5) CMPREF VREF CN1
Comparator 1
OE1 CO1 Change Detect CMF1
CMP1 (P0.6)
Interrupt Change Detect CP2 (P0.2) CIN2A (P0.1) CIN2B CMP2 (P0.0) CO2 OE2 CN2
002aaa422
EC CMF2
Comparator 2
Fig 13. Comparator input and output connections.
8.20.1
Internal reference voltage An internal reference voltage generator may supply a default reference when a single comparator input pin is used. The value of the internal reference voltage, referred to as VREF, is 1.23 V 10%.
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8.20.2
Comparator interrupt Each comparator has an interrupt flag contained in its configuration register. This flag is set whenever the comparator output changes state. The flag may be polled by software or may be used to generate an interrupt. The two comparators use one common interrupt vector. If both comparators enable interrupts, after entering the interrupt service routine, the user needs to read the flags to determine which comparator caused the interrupt.
8.20.3
Comparators and power reduction modes Either or both comparators may remain enabled when Power-down or Idle mode is activated, but both comparators are disabled automatically in Total Power-down mode. If a comparator interrupt is enabled (except in Total Power-down mode), a change of the comparator output state will generate an interrupt and wake up the processor. If the comparator output to a pin is enabled, the pin should be configured in the push-pull mode in order to obtain fast switching times while in power-down mode. The reason is that with the oscillator stopped, the temporary strong pull-up that normally occurs during switching on a quasi-bidirectional port pin does not take place. Comparators consume power in Power-down and Idle modes, as well as in the normal operating mode. This fact should be taken into account when system power consumption is an issue. To minimize power consumption, the user can disable the comparators via PCONA.5, or put the device in Total Power-down mode.
8.21 Keypad interrupt (KBI)
The Keypad Interrupt function is intended primarily to allow a single interrupt to be generated when Port 0 is equal to or not equal to a certain pattern. This function can be used for bus address recognition or keypad recognition. The user can configure the port via SFRs for different tasks. The Keypad Interrupt Mask Register (KBMASK) is used to define which input pins connected to Port 0 can trigger the interrupt. The Keypad Pattern Register (KBPATN) is used to define a pattern that is compared to the value of Port 0. The Keypad Interrupt Flag (KBIF) in the Keypad Interrupt Control Register (KBCON) is set when the condition is matched while the Keypad Interrupt function is active. An interrupt will be generated if enabled. The PATN_SEL bit in the Keypad Interrupt Control Register (KBCON) is used to define equal or not-equal for the comparison. In order to use the Keypad Interrupt as an original KBI function like in 87LPC76x series, the user needs to set KBPATN = 0FFH and PATN_SEL = 1 (not equal), then any key connected to Port 0 which is enabled by the KBMASK register will cause the hardware to set KBIF and generate an interrupt if it has been enabled. The interrupt may be used to wake up the CPU from Idle or Power-down modes. This feature is particularly useful in handheld, battery-powered systems that need to carefully manage power consumption yet also need to be convenient to use. In order to set the flag and cause an interrupt, the pattern on Port 0 must be held longer than 6 CCLKs.
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8.22 Watchdog timer
The Watchdog timer causes a system reset when it underflows as a result of a failure to feed the timer prior to the timer reaching its terminal count. It consists of a programmable 12-bit prescaler, and an 8-bit down counter. The down counter is decremented by a tap taken from the prescaler. The clock source for the prescaler is either the PCLK or the nominal 400 kHz Watchdog oscillator. The Watchdog timer can only be reset by a power-on reset. When the Watchdog feature is disabled, it can be used as an interval timer and may generate an interrupt. Figure 14 shows the Watchdog timer in Watchdog mode. Feeding the watchdog requires a two-byte sequence. If PCLK is selected as the Watchdog clock and the CPU is powered-down, the watchdog is disabled. The Watchdog timer has a time-out period that ranges from a few s to a few seconds. Please refer to the P89LPC930/931 User's Manual for more details.
WDL (C1H)
MOV WFEED1, #0A5H MOV WFEED2, #05AH Watchdog oscillator PCLK
/32
PRESCALER
8-BIT DOWN COUNTER
RESET see note (1)
CONTROL REGISTER
SHADOW REGISTER FOR WDCON
WDCON (A7H)
PRE2
PRE1
PRE0
-
-
WDRUN
WDTOF
WDCLK
002aaa423
(1) Watchdog reset can also be caused by an invalid feed sequence, or by writing to WDCON not immediately followed by a feed sequence.
Fig 14. Watchdog timer in Watchdog mode (WDTE = `1').
8.23 Additional features
8.23.1 Software reset The SRST bit in AUXR1 gives software the opportunity to reset the processor completely, as if an external reset or Watchdog reset had occurred. Care should be taken when writing to AUXR1 to avoid accidental software resets. 8.23.2 Dual data pointers The dual Data Pointers (DPTR) provides two different Data Pointers to specify the address used with certain instructions. The DPS bit in the AUXR1 register selects one of the two Data Pointers. Bit 2 of AUXR1 is permanently wired as a logic `0' so that the DPS bit may be toggled (thereby switching Data Pointers) simply by incrementing the AUXR1 register, without the possibility of inadvertently altering other bits in the register.
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8-bit microcontrollers with two-clock 80C51 core
8.24 Flash program memory
8.24.1 General description The P89LPC930/931 Flash memory provides in-circuit electrical erasure and programming. The Flash can be read, erased, or written as bytes. The Sector and Page Erase functions can erase any Flash sector (1 kB) or page (64 bytes). The Chip Erase operation will erase the entire program memory. In-System Programming and standard parallel programming are both available. On-chip erase and write timing generation contribute to a user-friendly programming interface. The P89LPC930/931 Flash reliably stores memory contents even after more than 100,000 erase and program cycles. The cell is designed to optimize the erase and programming mechanisms. The P89LPC930/931 uses VDD as the supply voltage to perform the Program/Erase algorithms. 8.24.2 Features
* Byte-erase allowing code memory to be used for data storage. * Internal fixed boot ROM, containing low-level In-Application Programming (IAP)
routines.
* User programs can call these routines to perform In-Application Programming
(IAP).
* Default loader providing In-System Programming via the serial port, located in
upper end of user program memory.
* Boot vector allows user-provided Flash loader code to reside anywhere in the
Flash memory space, providing flexibility to the user.
* * * * * * *
8.24.3
Programming and erase over the full operating voltage range. Programming/Erase using ISP/IAP. Any flash program/erase operation in 2 ms. Parallel programming with industry-standard commercial programmers. Programmable security for the code in the Flash for each sector. More than 100,000 typical erase/program cycles for each byte. 10 year minimum data retention.
Using Flash as data storage The Flash code memory array of this device supports individual byte erasing and programming. Any byte in the code memory array may be read using the MOVC instruction, provided that the sector containing the byte has not been secured (a MOVC instruction is not allowed to read code memory contents of a secured sector). Thus any byte in a non-secured sector may be used for non-volatile data storage.
8.24.4
ISP and IAP capabilities of the P89LPC930/931 Flash organization: The P89LPC930/931 program memory consists of eight 1 KB sectors. Each sector can be further divided into 64-byte pages. In addition to sector erase and page erase, a 64-byte page register is included which allows from 1 to 64 bytes of a given page to be programmed at the same time, substantially reducing overall programming time. An In-Application Programming (IAP) interface is provided to allow the end user's application to erase and reprogram the user code memory. In
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addition, erasing and reprogramming of user-programmable bytes including UCFG1, the Boot Status Bit, and the Boot Vector is supported. As shipped from the factory, the upper 512 bytes of user code space contains a serial In-System Programming (ISP) routine allowing for the device to be programmed in circuit through the serial port. Flash programming and erasing: There are three methods of erasing or programming of the Flash memory that may be used. First, the Flash may be programmed or erased in the end-user application by calling low-level routines through a common entry point. Second, the on-chip ISP boot loader may be invoked. This ISP boot loader will, in turn, call low-level routines through the same common entry point that can be used by the end-user application. Third, the Flash may be programmed or erased using the parallel method by using a commercially available EPROM programmer which supports this device. This device does not provide for direct verification of code memory contents. Instead this device provides a 32-bit CRC result on either a sector or the entire 8 kbytes of user code space. Boot ROM: When the microcontroller programs its own Flash memory, all of the low level details are handled by code that is contained in a Boot ROM that is separate from the Flash memory. A user program simply calls the common entry point in the Boot ROM with appropriate parameters to accomplish the desired operation. The Boot ROM include operations such as erase sector, erase page, program page, CRC, program security bit, etc. The Boot ROM occupies the program memory space at the top of the address space from FF00 to FEFF hex, thereby not conflicting with the user program memory space. Power-on reset code execution: The P89LPC930/931 contains two special Flash elements: the Boot Vector and the Boot Status Bit. Following reset, the P89LPC930/931 examines the contents of the Boot Status Bit. If the Boot Status Bit is set to zero, power-up execution starts at location 0000H, which is the normal start address of the user's application code. When the Boot Status Bit is set to a value other than zero, the contents of the Boot Vector is used as the high byte of the execution address and the low byte is set to 00H. The factory default setting is 01EH (0EH for the LPC930), corresponds to the address 1E00H (0E00h for the LPC930) for the default ISP boot loader. This boot loader is pre-programmed at the factory into this address space and can be erased by the user. Users who wish to use this loader should take cautions to avoid erasing the 1 kbyte sector from 1C00H to 1FFFH (0C00H to 0FFFH for the LPC930). Instead, the page erase function can be used to erase the eight (four for the LPC930) 64-byte pages located from 1C00H to 1DFFH (0C00H to 0DFFH for the LPC930). A custom boot loader can be written with the Boot Vector set to the custom boot loader, if desired. Hardware activation of the boot loader: The boot loader can also be executed by forcing the device into ISP mode during a power-on sequence (see the P89LPC930/931 User's Manual for specific information). This has the same effect as having a non-zero status byte. This allows an application to be built that will normally execute user code but can be manually forced into ISP operation. If the factory default setting for the Boot Vector (1EH for the lPC931, 0EH for the LPC930) is changed, it will no longer point to the factory pre-programmed ISP boot loader code. If this happens, the only way it is possible to change the contents of the Boot Vector is through the parallel programming method, provided that the end user application does not contain a customized loader that provides for erasing and reprogramming of
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the Boot Vector and Boot Status Bit. After programming the Flash, the status byte should be programmed to zero in order to allow execution of the user's application code beginning at address 0000H. In-System Programming (ISP): In-System Programming is performed without removing the microcontroller from the system. The In-System Programming facility consists of a series of internal hardware resources coupled with internal firmware to facilitate remote programming of the P89LPC930/931 through the serial port. This firmware is provided by Philips and embedded within each P89LPC930/931 device. The Philips In-System Programming facility has made in-system programming in an embedded application possible with a minimum of additional expense in components and circuit board area. The ISP function uses five pins (VDD, VSS, TxD, RxD, and RST). Only a small connector needs to be available to interface your application to an external circuit in order to use this feature. In-Application Programming (IAP): Several In-Application Programming (IAP) calls are available for use by an application program to permit selective erasing, reading, and programming of Flash sectors, pages, security bits, configuration bytes, and device id. All calls are made through a common interface, PGM_MTP. The programming functions are selected by setting up the microcontroller's registers before making a call to PGM_MTP at FF00H.
8.25 User configuration bytes
A number of user-configurable features of the P89LPC930/931 must be defined at power-up and therefore cannot be set by the program after start of execution. These features are configured through the use of the Flash byte UCFG1. Please see the P89LPC930/931 User's Manual for additional details.
8.26 User sector security bytes
There are eight User Sector Security Bytes, each corresponding to one sector. Please see the P89LPC930/931 User's Manual for additional details.
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9. Limiting values
Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Tamb(bias) Tstg Vxtal Vn IOH(I/O) IOL(I/O) II/O(tot)(max) Ptot(pack) Parameter operating bias ambient temperature storage temperature range voltage on XTAL1, XTAL2 pin to VSS voltage on any other pin to VSS HIGH-level output current per I/O pin LOW-level output current per I/O pin maximum total I/O current total power dissipation per package based on package heat transfer, not device power consumption Conditions Min -55 -65 -0.5 Max +125 +150 VDD + 0.5 +5.5 20 20 100 1.5 Unit C C V V mA mA mA W
[1]
[2] [3]
Stresses above those listed under Table 6 "Limiting values" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in Table 7 "DC electrical characteristics" and DC Electrical Characteristics section of this specification are not implied. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted.
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10. Static characteristics
Table 7: DC electrical characteristics VDD = 2.4 V to 3.6 V unless otherwise specified. Tamb = -40 C to +85 C for industrial, unless otherwise specified. Symbol IDD IID IPD Parameter power supply current, Idle mode Power supply current, Power-down mode, voltage comparators powered-down Power supply current, Total Power-down mode VDD rise time VDD fall time Power-on reset detect voltage RAM keep-alive voltage negative-going threshold voltage (except SCL, SDA) LOW-level input voltage (SCL, SDA only) positive-going threshold voltage (except SCL, SDA) HIGH-level input voltage (SCL, SDA only) hysteresis voltage LOW-level output voltage; all ports, all modes except Hi-Z[3] Port 1 IOL = 20 mA; VDD = 2.4 V to 3.6 V IOL = 3.2 mA; VDD = 2.4 V to 3.6 V VOH HIGH-level output voltage, all ports IOH = -20 A; VDD = 2.4 V to 3.6 V; quasi-bidirectional mode IOH = -3.2 mA; VDD = 2.4 V to 3.6 V; push-pull mode IOH = -20 mA; VDD = 2.4 V to 3.6 V; push-pull mode Cio IIL ILI ITL RRST input/output pin capacitance logic 0 input current, all ports input leakage current, all ports logic 1-to-0 transition current, all ports internal reset pull-up resistor VIN = 0.4 V VIN = VIL or VIH VIN = 2.0 V at VDD = 3.6 V
[4] [5] [6] [7]
Conditions
[2] [2]
Min -
Typ[1] 11 3.25 -
Max 18 5
Unit mA mA A
power supply current, operating 3.6 V; 12 MHz 3.6 V; 12 MHz 3.6 V
[2]
IPD1 VDDR VDDF VPOR VRAM Vth(HL) VIL1 Vth(LH) VIH1 Vhys VOL
3.6 V
[2]
1.5 0.22VDD -0.5 0.7VDD VDD - 0.3
1 0.4VDD 0.6VDD 0.2VDD 0.6 0.2 VDD - 0.2
5 2 50 0.2 0.3VDD 0.7VDD 5.5 1.0 0.3 -
A mV/s mV/s V V V V V V V V V V
VDD - 0.7
VDD - 0.4
-
V

-
-
V
-30 10
-
15 -80 10 -450 30
pF A A A k
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Table 7: DC electrical characteristics...continued VDD = 2.4 V to 3.6 V unless otherwise specified. Tamb = -40 C to +85 C for industrial, unless otherwise specified. Symbol VBO VREF TC(VREF) Parameter brownout trip voltage with BOV = `0', BOPD = `1' bandgap reference voltage bandgap temperature coefficient Conditions 2.4 V < VDD < 3.6 V Min 2.40 1.11 Typ[1] 1.23 10 Max 2.70 1.34 20 Unit V V ppm/ C
[1] [2] [3] [4] [5] [6] [7]
Typical ratings are not guaranteed. The values listed are at room temperature, 3 V. The IDD, IID, and IPD specifications are measured using an external clock with the following functions disabled: comparators, brownout detect, and Watchdog timer. See Table 6 "Limiting values" on page 39 for steady state (non-transient) limits on IOL or IOH. If IOL/IOH exceeds the test condition, VOL/VOH may exceed the related specification. Pin capacitance is characterized but not tested. Measured with port in quasi-bidirectional mode. Measured with port in high-impedance mode. Port pins source a transition current when used in quasi-bidirectional mode and externally driven from `1' to `0'. This current is highest when VIN is approximately 2 V.
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11. Dynamic characteristics
Table 8: AC characteristics Tamb = -40 C to +85 C for industrial, unless otherwise specified.[1] Symbol fRCOSC fWDOSC fOSC tCLCL fCLKP Glitch filter glitch rejection, P1.5/RST pin signal acceptance, P1.5/RST pin glitch rejection, any pin except P1.5/RST signal acceptance, any pin except P1.5/RST External clock tCHCX tCLCX tCLCH tCHCL tXLXL tQVXH tXHQX tXHDX tDVXH fSPI HIGH time LOW time rise time fall time serial port clock cycle time output data set-up to clock rising edge output data hold after clock rising edge input data hold after clock rising edge input data valid to clock rising edge Operating frequency 2.0 MHz (Master) 2.0 MHz (Slave) 3.0 MHz (Master) 3.0 MHz (Slave) tSPICYC Cycle time 2.0 MHz (Master) 2.0 MHz (Slave) 3.0 MHz (Master) 3.0 MHz (Slave)
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Parameter internal RC oscillator frequency internal Watchdog oscillator frequency oscillator frequency clock cycle CLKLP active frequency
Conditions
Variable clock Min 7.189 280 0 Max 7.557 480 12 8 50 15 -
fOSC = 12 MHz Min 7.189 280 125 50 Max 7.557 480 50 15 -
Unit MHz kHz MHz ns MHz ns ns ns ns
see Figure 20
83 0 125 50
see Figure 20 see Figure 20 see Figure 20 see Figure 20
33 33 16 tCLCL 13 tCLCL 150
tCLCL - tCLCX tCLCL - tCHCX 8 8 tCLCL + 20 0 -
33 33 1333 1083 150
8 8 103 0 -
ns ns ns ns ns ns ns ns ns
Shift register (UART mode 0)
SPI interface 0 0 see Figures 15, 16, 17, 18 500 333
Rev. 04 -- 06 January 2004
2.0 3.0
0 0
2.0 3.0
MHz MHz MHz MHz
-
500 333
-
ns ns ns ns
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Table 8: AC characteristics...continued Tamb = -40 C to +85 C for industrial, unless otherwise specified.[1] Symbol tSPILEAD Parameter Enable lead time (Slave) 2.0 MHz 3.0 MHz tSPILAG Enable lag time (Slave) 2.0 MHz 3.0 MHz tSPICLKH SPICLK high time Master Slave tSPICLKL SPICLK low time Master Slave tSPIDSU tSPIDH tSPIA tSPIDIS Data set-up time (Master or Slave) see Figures 15, 16, 17, 18 Data hold time (Master or Slave) Access time (Slave) Disable time (Slave) 2.0 MHz 3.0 MHz tSPIDV Enable to output data valid 2.0 MHz 3.0 MHz tSPIOH tSPIR Output data hold time Rise time SPI outputs (SPICLK, MOSI, MISO) SPI inputs (SPICLK, MOSI, MISO, SS) see Figures 15, 16, 17, 18 see Figures 15, 16, 17, 18 100 2000 100 2000 ns ns see Figures 15, 16, 17, 18 0 0 0 240 167 0 240 167 ns ns ns see Figures 15, 16, 17, 18 see Figures 17, 18 see Figures 17, 18 0 0 240 167 240 167 ns ns see Figures 15, 16, 17, 18 340 190 100 100 0 120 340 190 100 100 0 120 ns ns ns ns ns see Figures 15, 16, 17, 18 340 190 340 190 ns ns see Figures 17, 18 250 240 250 240 ns ns Conditions see Figures 17, 18 250 240 250 240 ns ns Variable clock Min Max fOSC = 12 MHz Min Max Unit
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Table 8: AC characteristics...continued Tamb = -40 C to +85 C for industrial, unless otherwise specified.[1] Symbol tSPIF Parameter Fall time SPI outputs (SPICLK, MOSI, MISO) SPI inputs (SPICLK, MOSI, MISO, SS)
[1] [2]
Conditions see Figures 15, 16, 17, 18
Variable clock Min Max
fOSC = 12 MHz Min Max
Unit
-
100 2000
-
100 2000
ns ns
Parameters are valid over operating temperature range unless otherwise specified. Parts are tested to 2 MHz, but are guaranteed to operate down to 0 Hz.
SS tCLCL tSPIF tSPICLKH SPICLK (CPOL = 0) (output) tSPICLKL tSPIR
tSPIF
tSPICLKL
tSPIR tSPICLKH
SPICLK (CPOL = 1) (output) tSPIDSU MISO (input) tSPIDH LSB/MSB in tSPIOH tSPIDV tSPIR
MSB/LSB in tSPIDV
MOSI (output)
tSPIF Master MSB/LSB out Master LSB/MSB out
002aaa156
Fig 15. SPI master timing (CPHA = 0).
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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
SS tCLCL tSPIF tSPICLKL tSPIR tSPICLKH
SPICLK (CPOL = 0) (output)
tSPIF tSPICLKH
tSPICLKL
tSPIR
SPICLK (CPOL = 1) (output) tSPIDSU MISO (input) tSPIDH LSB/MSB in tSPIOH tSPIDV tSPIDV tSPIR Master MSB/LSB out Master LSB/MSB out
MSB/LSB in tSPIDV
MOSI (output)
tSPIF
002aaa157
Fig 16. SPI master timing (CPHA = 1).
SS tSPIR tSPIR tSPILAG
tSPIR tSPILEAD tSPIF
tCLCL tSPICLKH tSPICLKL
SPICLK (CPOL = 0) (input)
tSPIF
tSPICLKL
tSPIR tSPICLKH
SPICLK (CPOL = 1) (input) tSPIA MISO (output) tSPIOH tSPIDV Slave MSB/LSB out tSPIOH tSPIDV
tSPIOH tSPIDIS Slave LSB/MSB out Not defined
tSPIDSU MOSI (input)
tSPIDH
tSPIDSU
tSPIDSU
tSPIDH
MSB/LSB in
LSB/MSB in
002aaa158
Fig 17. SPI slave timing (CPHA = 0).
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P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
SS tSPIR tSPIR tSPILAG
tSPIR tSPILEAD tSPIF
tCLCL tSPICLKH tSPICLKL
SPICLK (CPOL = 0) (input)
tSPIF
tSPICLKL
tSPIR tSPICLKH
SPICLK (CPOL = 1) (input) tSPIOH tSPIDV tSPIA MISO (output) Not defined Slave MSB/LSB out Slave LSB/MSB out tSPIOH tSPIDV tSPIOH tSPIDV tSPIDIS
tSPIDSU MOSI (input)
tSPIDH
tSPIDSU
tSPIDSU
tSPIDH
MSB/LSB in
LSB/MSB in
002aaa159
Fig 18. SPI slave timing (CPHA = 1).
tXLXL Clock tQVXH Output Data 0 Write to SBUF Input Data Clear RI Set RI
002aaa425
tXHQX 1 tXHDX Set TI
Valid Valid Valid Valid Valid Valid Valid Valid
2
3
4
5
6
7
tXHDV
Fig 19. Shift register mode timing.
VDD - 0.5 V 0.45 V
0.2 VDD + 0.9 0.2 VDD - 0.1 V tCHCX
tCHCL
tCLCX
tC
tCLCH
002aaa416
Fig 20. External clock timing.
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Product data
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Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Table 9: AC characteristics, ISP entry mode VDD = 2.4 V to 3.6 V, unless otherwise specified. Tamb = -40 C to +85 C for industrial, unless otherwise specified. Symbol tVR tRH tRL Parameter RST delay from VDD active RST HIGH time RST LOW time Conditions Min 50 1 1 Typ Max 32 Unit s s s
VDD tVR RST
002aaa426
tRH
tRL
Fig 21. ISP entry waveform.
12. Comparator electrical characteristics
Table 10: Comparator electrical characteristics VDD = 2.4 V to 3.6 V, unless otherwise specified. Tamb = -40 C to +85 C for industrial, unless otherwise specified. Symbol VIO VCR CMRR Parameter offset voltage comparator inputs common mode range comparator inputs common mode rejection ratio response time comparator enable to output valid IIL
[1]
[1]
Conditions
Min 0 -
Typ 250 -
Max 20 VDD - 0.3 -50 500 10 10
Unit mV V dB ns s A
input leakage current, comparator
0 < VIN < VDD
-
This parameter is characterized, but not tested in production.
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13. Package outline
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1
D
E
A
X
c y HE vMA
Z
28
15
Q A2 pin 1 index A1 (A 3) A
Lp L detail X
1
e bp
14
wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 9.8 9.6 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.5 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT361-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 22. SOT361-1.
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14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
14.5 Package related soldering information
Table 11: Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, USON, VFBGA Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable Reflow[2] suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, not suitable[4] HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
suitable not WQCCN..L[8] recommended[5][6] not recommended[7] not suitable
suitable suitable suitable not suitable
PMFP[9],
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
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8-bit microcontrollers with two-clock 80C51 core
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[3]
[4]
[5] [6] [7] [8]
[9]
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15. Revision history
Table 12: Rev Date 04 20040106 Revision history CPCN Description Product data (9397 750 12284); ECN 853-2406 01-A15015 dated 16 December 2003 Modifications:
* * * * * *
03 02 01 20031006 20030526 20030514 -
Table 4 "Special function registers" on page 12: added FMADRH, FMADRL, FMCON, and FMDATA. Section 8.2.6 "Clock output" on page 17: adjusted second sentence. Section 8.20.1 "Internal reference voltage" on page 33: adjusted second sentence. Section 8.24.2 "Features" on page 36: adjusted second to last bullet. Table 7 "DC electrical characteristics" on page 40: ITL VIN conditions; changed value from 1.5 V to 2.0 V. Table 8 "AC characteristics" on page 42: adjusted fCLKP variable clock max value from 4 to 8.
Product data (9397 750 12122); ECN 853-2406 30390 dated 30 September 2003. Objective data (9397 750 11536) Preliminary data (9397 750 11386)
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16. Data sheet status
Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Licenses
Purchase of Philips I2C components Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
18. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
9397 750 12284
Fax: +31 40 27 24825
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Contents
1 2 3 3.1 4 5 5.1 5.2 6 7 8 8.1 8.2 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 8.2.6 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.10.1 8.11 8.11.1 8.11.2 8.11.3 8.11.4 8.11.5 8.11.6 8.11.7 8.12 8.12.1 8.12.2 8.13 8.13.1 8.13.2 8.13.3 8.14 8.14.1 8.15 8.15.1 8.15.2 8.15.3 8.15.4 8.15.5 8.15.6 8.16 8.17 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pinning information. . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Special function registers. . . . . . . . . . . . . . . . . . . . . 11 Functional description . . . . . . . . . . . . . . . . . . . . . . . 16 Enhanced CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Clock definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 CPU clock (OSCCLK) . . . . . . . . . . . . . . . . . . . . . . . 16 Low speed oscillator option . . . . . . . . . . . . . . . . . . . 16 Medium speed oscillator option . . . . . . . . . . . . . . . . 16 High speed oscillator option . . . . . . . . . . . . . . . . . . . 16 Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 On-chip RC oscillator option . . . . . . . . . . . . . . . . . . 17 Watchdog oscillator option . . . . . . . . . . . . . . . . . . . . 17 External clock input option . . . . . . . . . . . . . . . . . . . . 17 CPU CLock (CCLK) wake-up delay . . . . . . . . . . . . . 18 CPU CLOCK (CCLK) modification: DIVM register . . 18 Low power select . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . 18 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 External interrupt inputs . . . . . . . . . . . . . . . . . . . . . . 19 I/O ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Port configurations . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Quasi-bidirectional output configuration. . . . . . . . . . 21 Open-drain output configuration. . . . . . . . . . . . . . . . 21 Input-only configuration . . . . . . . . . . . . . . . . . . . . . . 21 Push-pull output configuration . . . . . . . . . . . . . . . . . 21 Port 0 analog functions . . . . . . . . . . . . . . . . . . . . . . 21 Additional port features . . . . . . . . . . . . . . . . . . . . . . 22 Power monitoring functions . . . . . . . . . . . . . . . . . . . 22 Brownout detection . . . . . . . . . . . . . . . . . . . . . . . . . 22 Power-on detection . . . . . . . . . . . . . . . . . . . . . . . . . 22 Power reduction modes . . . . . . . . . . . . . . . . . . . . . . 23 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Power-down mode . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Total Power-down mode . . . . . . . . . . . . . . . . . . . . . . 23 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Reset vector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Timers/counters 0 and 1 . . . . . . . . . . . . . . . . . . . . . 24 Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Mode 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Mode 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Mode 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Mode 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Timer overflow toggle output . . . . . . . . . . . . . . . . . . 25 Real-Time clock/system timer . . . . . . . . . . . . . . . . . 25 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Mode 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Mode 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Mode 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Mode 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Baud rate generator and selection . . . . . . . . . . . . . . 26 Framing error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Break detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Double buffering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Transmit interrupts with double buffering enabled (Modes 1, 2 and 3) . . . . . . . . . . . . . . . . . . . 27 8.17.10 The 9th bit (bit 8) in double buffering (Modes 1, 2 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8.18 I2C-bus serial interface . . . . . . . . . . . . . . . . . . . . . . . 28 8.19 Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . 29 8.19.1 Typical SPI configurations. . . . . . . . . . . . . . . . . . . . . 31 8.20 Analog comparators . . . . . . . . . . . . . . . . . . . . . . . . . 33 8.20.1 Internal reference voltage . . . . . . . . . . . . . . . . . . . . . 33 8.20.2 Comparator interrupt. . . . . . . . . . . . . . . . . . . . . . . . . 34 8.20.3 Comparators and power reduction modes . . . . . . . . 34 8.21 Keypad interrupt (KBI) . . . . . . . . . . . . . . . . . . . . . . . 34 8.22 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.23 Additional features . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.23.1 Software reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.23.2 Dual data pointers. . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.24 Flash program memory. . . . . . . . . . . . . . . . . . . . . . . 36 8.24.1 General description. . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.24.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 8.24.3 Using Flash as data storage . . . . . . . . . . . . . . . . . . . 36 8.24.4 ISP and IAP capabilities of the P89LPC930/931 . . . 36 8.25 User configuration bytes . . . . . . . . . . . . . . . . . . . . . . 38 8.26 User sector security bytes . . . . . . . . . . . . . . . . . . . . 38 9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 10 Static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 40 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . 42 12 Comparator electrical characteristics . . . . . . . . . . . 47 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 14 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 14.1 Introduction to soldering surface mount packages . . 49 14.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 14.5 Package related soldering information . . . . . . . . . . . 50 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 17 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 19 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 8.17.1 8.17.2 8.17.3 8.17.4 8.17.5 8.17.6 8.17.7 8.17.8 8.17.9
(c) Koninklijke Philips Electronics N.V. 2004. Printed in the U.S.A.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 06 January 2004 Document order number: 9397 750 12284

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